Based on the previous focus on the need for hot runner sensor data acquisition to adapt to high-temperature and strong electromagnetic interference conditions, the following are some recommendations for domestically produced high-temperature resistant data acquisition modules suitable for this scenario:
Lingzhi Circuit High-Temperature PCB Matching Acquisition Module: Customized for high-temperature industrial scenarios, the core board can withstand temperatures up to 105℃, adapting to the high-temperature environment surrounding hot runners, and exhibiting excellent anti-interference performance.
Donghui Instrument DY2000 High-Temperature Acquisition Module: Wide temperature coverage -30℃~90℃, supports thermocouple/PT100 access, optimized for injection molding hot runner scenarios, with no temperature drift during long-term operation.
Jizhida RuggDAU Series Industrial Acquisition Module: Reinforced with an all-metal shell, temperature range -40℃~85℃, with full isolation protection, suitable for centralized data acquisition of multiple hot runner clusters.
Yanxiang EIO Series Remote IO Acquisition Module: Industrial-grade wide-temperature design, supports multi-channel synchronous acquisition, can operate stably at 85℃, suitable for high-end precision injection molding scenarios. These domestically produced modules have specifically addressed the high-temperature challenges in hot runner scenarios and can meet the high-temperature resistance requirements of different operating conditions.
